PART 413—ELECTROPLATING POINT SOURCE CATEGORY
- General Provisions (§§ 413.01 - 413.04)
- Subpart A—Electroplating of Common Metals Subcategory (§§ 413.10 - 413.14)
- Subpart B—Electroplating of Precious Metals Subcategory (§§ 413.20 - 413.24)
- Subpart C—Electroplating of Speciality Metals Subcategory [Reserved]
- Subpart D—Anodizing Subcategory (§§ 413.40 - 413.44)
- Subpart E—Coatings Subcategory (§§ 413.50 - 413.54)
- Subpart F—Chemical Etching and Milling Subcategory (§§ 413.60 - 413.64)
- Subpart G—Electroless Plating Subcategory (§§ 413.70 - 413.74)
- Subpart H—Printed Circuit Board Subcategory (§§ 413.80 - 413.84)